TSMC is planning to launch 3nm in 2023, and 2nm in 2025

At its 2022 TSMC Technology Symposium, TSMC outlined the timeline for its chip development. In the second half of this year, TSMC will release 3nm chips for the first time in the world, with 2nm technology making its debut in 2025. There will be five tiers of 3nm chips: N3 (Enhanced), N3E (Enhanced), N3P (Performance Enhanced), N3S (Density Enhanced), and N3X (Ultra High Performance).

At the same power draw, the 2nm node improves performance by 10% to 15% while reducing energy use by 25% to 30%, compared to the N3E generation. Chip density is higher with N2 than with N3E (1.1 times).

Also, TSMC introduced GAAFETs (gate-all-around field-effect transistors). The new nanosheet transistors will increase performance per watt by reducing resistance.

At the same time, Samsung Foundry will also begin mass-producing 3nm chips in 2022, amd plans to begin producing 2nm chips in 2025, as well.