Samsung unveils new AI memory chip with currently record capacity

Samsung Electronics has announced the HBM3E 12H high-speed memory chip, which it claims has the highest capacity in the industry today.

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According to Samsung, the new product outperforms its predecessors by more than 50 per cent in performance and memory capacity.

The chip is focused on the growing needs of artificial intelligence services. It has a 12-layer architecture, but thanks to improved technology occupies the same volume as 8-layer solutions. This has enabled a 20 per cent increase in cell density compared to the previous HBM3 range.

Samsung has already started shipping HBM3E 12H to partners, and mass production is scheduled for the first half of 2024. According to analysts, the new development will strengthen the company's position in the market of solutions for artificial intelligence, where demand for performance memory is growing.

Previously, Samsung's competitor SK Hynix was a leader in the production of HBM3 chips, including for NVIDIA. Now the Korean technology giant intends to regain its supremacy in this segment.

Source: CNBC