TSMC considers expanding capacity in Japan

According to sources, the Taiwanese chipmaker plans to set up advanced production facilities in Japan.

Here's What We Know

The discussions are at an early stage, according to sources close to the matter, who also declined to disclose all the details as the information is not public.

One of the options TSMC is considering is to introduce a chip packaging technology in Japan called CoWoS. Currently, all the capacity for this technology is located in Taiwan.

Also, according to insiders, no decisions have been made on the scale or timing of potential investments.

Flashback

CoWoS is a method that allows different crystals for complex high-performance chips to be placed on the same substrate, i.e. they are stacked on top of each other. In this way, power is increased, space is saved and power consumption is reduced.

Source: Reuters