Samsung plans to borrow $3.6bn to expand chip production globally

Samsung is planning to borrow $3.6 billion to build new chip manufacturing plants both in South Korea and abroad. This investment is intended to increase the company's production capacity and competitiveness in the semiconductor segment.

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The loans will be provided as part of a USD 10 billion loan package introduced by the South Korean government to develop the domestic semiconductor industry.

In addition, Samsung is considering issuing its first corporate bonds in South Korea since 2001 and overseas since April 2012. These steps are aimed at raising additional resources to finance strategic initiatives, particularly in the field of artificial intelligence chips.

Earlier this year, Samsung also began the process of bringing billions of dollars in cash back from its overseas subsidiaries to its headquarters in South Korea. The funds are likely to be used to finance new chip factories and potential acquisitions.

Source: SamMobile