SK Hynix announced the next generation of UFS 4.1 and ZUFS 4.0 memory

South Korean semiconductor manufacturer SK Hynix has unveiled new storage products at the FMS 2024 Summit. The company demonstrated 512GB and 1TB UFS 4.1 universal flash memory based on 321-layer stacked V9 1TB TLC NAND flash, as well as a new type of memory for improved AI processing - ZUFS 4.0.

Here's What We Know

The new chips meet the announced specifications, including 2.4Gbps data transfer rates for TLC. New 2TB QLC V9 samples have also been unveiled, delivering 3.2Gbps and the high-speed 1TB TLC V9H with 3.6Gbps.

UFS 4.1 is expected to improve storage performance in smartphones and other electronic devices. Detailed specifications of the UFS 4.1 chips have not yet been released, but they are expected to deliver data transfer rates of up to 8Gbps, which is double the capabilities of UFS 4.0.

The company also demonstrated 512GB and 1TB ZUFS 4.0 (Zoned Universal Flash Storage) drives. This is a new type of NAND flash memory that increases the speed of a smartphone's operating system over standard UFS. This memory is optimised for enhanced performance of AI-based applications.

The new UFS 4.1 drives are expected to appear in smartphones such as the Galaxy S25 Ultra.

Source: SK Hynix