Honor CEO Lee Kun reveals details about Magic V4: Snapdragon 8 Elite chip and slimmer design

Honor is preparing to release the Magic V4 foldable smartphone, which can not only challenge Oppo Find N5 in terms of thickness, but also outperform it in terms of performance. This was hinted at by Li Kun, the general manager of the flagship line of Honor smartphones.

Here's What We Know

According to preliminary information, the Magic V4 will receive an 8-core Snapdragon 8 Elite, while the Oppo Find N5 uses a 7-core version of this processor. In Geekbench tests, the latter showed 2,885 points in single-core mode and 7,978 in multi-core mode. For comparison, the full-fledged Snapdragon 8 Elite in OnePlus 13 scored 3,107 and 9,213 points, respectively. The differences are also noticeable in graphics performance: The GPU in the Oppo Find N5 scored 13,875 points in the Digital Trends benchmarks, while the same chip in the OnePlus 13 reached 18,065 points.

In terms of design, the Oppo Find N5 is currently the thinnest foldable smartphone on the market with a thickness of 8.93 mm when folded. However, according to recent leaks, the Honor Magic V4 could be even thinner at 8.9 mm or even less. If this information is confirmed, Honor will have an advantage in this segment.

However, there is the issue of cooling. In a thin body, a full-fledged Snapdragon 8 Elite can get very hot under load. If Honor doesn't provide an effective heat dissipation system, performance may drop due to overheating. The company is known to pay great attention to thermal management in its devices, so you can expect an advanced cooling system.

So far, Honor has not disclosed the official specifications of the Magic V4, but if the smartphone really gets a full-fledged Snapdragon 8 Elite and becomes the thinnest foldable device, it can seriously compete with the Oppo Find N5. The novelty is expected to be presented in the first half of 2025.

Source: CNMO