iFixit disassembled iPhone Air - smartphone is stronger and easier to repair than expected

The iFixit team took apart the new iPhone Air and were pleasantly surprised: the device has a modular design that makes it easy to replace components. The screen and battery are the most common candidates for replacement - they can now be replaced relatively easily.

The internal architecture has also undergone changes. Components are arranged in a modular way, with less glue and more screws. This not only simplifies repairs but also reduces the risk of damage during dismantling. In addition to the resilience of the frame, the unusual layout played a positive role. The iPhone Air battery takes up about two-thirds of the device's area. Previously, the motherboard could be damaged when bent, but now it is simply not in the centre - in the Air, it occupies the topmost position, and the most vulnerable central part contains only the battery, which is the most flexible of all internal components. There is also improved thermal insulation and protection against dust and water.

The battery itself has a metal casing, which further protects it from damage. Its capacity is 12.26 Wh (less than the iPhone 19 Pro with its 11.97 Wh) and it is absolutely identical to the battery of the proprietary MagSafe power bank.

Interestingly, Apple has clearly foreseen possible problems, so the central part of the frame is made of heavy-duty titanium and is very durable. The top and bottom parts, on the other hand, are less secure. This is due to the need to ensure the operation of the antenna, which required plastic inserts. Although it's harder to damage the top and bottom of a smartphone, these elements of the frame are the most vulnerable.

Engineers were enthusiastic about the unique USB-C port. The company uses some unknown technology for 3D printing titanium and the connector looks like a work of art under a microscope.

iFixit score

The iPhone Air received 7 out of 10 from iFixit. This is a very good score for modern smartphones. Despite the expectation of a very dense and unbreakable architecture, experts found that the reduction in thickness led to the disappearance of the multi-layer layout, and therefore the components are less interconnected.