Intel invests $4.6bn to build chip packaging and testing plant in Poland

Intel is actively investing in European countries. The US company will build a chip packaging and testing plant in Poland.

Here's What We Know

Patrick Gelsinger has paid a visit to Europe. The Intel CEO visited Poland and announced the construction of a new facility in the European country. The plant will appear by 2027.

The chip testing and packaging facility will be built in Wroclaw. The US company is ready to invest $4.6 billion to build it. Intel says the plant will create up to 2,000 new jobs for residents of Wroclaw and the surrounding area.

The company will build a semiconductor plant in Germany. From there, selected silicon wafers will be shipped to the Polish plant for testing and packaging. Malaysia, Vietnam, Costa Rica and China currently have such plants.

Source: Intel