Insider: Snapdragon 7 Gen 3 and Dimensity 8300 processors will debut next week

Qualcomm and MediaTek have recently unveiled their top-end mobile processors, and are now preparing to release new mid-range chips.

Here's What We Know

The information was shared by Chinese insider WHY LAB. According to the leak, the new processors will be revealed next week. The first to debut will be the SoC Snapdragon 7 Gen 3. It will be installed in the Honor 100 smartphone. If rumours are to be believed, the chipset will be built on TSMC's 4-nanometer process. It will get a single 2.63GHz Cortex A715 core, three 2.4GHz cores and four 1.8GHz cores. Adreno 720 graphics will be responsible for gaming in the Snapdragon 7 Gen 3.

As for the Dimensity 8300, it will make its debut in the Redmi K70e smartphone. The chip should get a single Cortex-X3 core clocked at 2.8GHz, three Cortex-A715 cores at 2.4GHz, four Cortex-A510 cores at 1.6GHz and G520 MC6 graphics.

Source: WHY LAB