TSMC released the world's first advanced N3E (3nm) chip

Taiwan-based semiconductor manufacturer TSMC was able to release the world's first chip, made by an improved 3-nm technology N3E.

Here's What We Know

The company created a new chip for semiconductor chip developer Alphaware. The ZeusCORE100 1-112Gbps NRZ/PAM4 Serialiser-Deserialiser (SerDes) sample consists of two functional blocks. They are typically used for the purpose of converting information between parallel and serial interfaces.

In the next 2-3 years, TSMC wants to release five variants of the 3nm process at once. The N3 technology will be envisioned for key customers like the U.S. company Apple. The second generation (N3E) will enable faster chip production, while improving performance and reducing power consumption.

The launch of mass production of chips with N3E technology will be held in about a year after the start of mass production chips, created by the N3 process technology, that is, no earlier than mid next year. After that, TSMC intends to start creating chips, using technology N3S and N3P to create chips with high density of transistors and high-performance chips, respectively. The manufacturer wants to realize the vision in 2024.

The last of the five variants of the N3 process is N3X. It will appear in 2025 and will become the mainstream for high-performance processors.

Source: Tom's Hardware