Insider: MediaTek's next flagship chip will be called Dimensity 9300 and will be built on new TSMC process technology

MediaTek is working on a new flagship processor for mobile phones.

Here's What We Know

This has been revealed by Digital Chat Station insider. The chip will be called Dimensity 9300. If the leak is to be believed, MediaTek is developing the SoC along with Chinese smartphone maker vivo.

The chipset will be built using TSMC's new N4P process. Thanks to this, the Dimensity 9300 will boast of increased performance and reduced power consumption. Also it will be equipped with Cortex X4, Cortex A715 and Cortex A515 cores.

When We Can Expect It

The MediaTek Dimensity 9300 is due to be unveiled in the second half of 2023. The processor will compete with the Snapdragon 8 Gen 3 chip. The first to get the new product could be the flagship smartphone vivo X100.

Source: Digital Chat Station