FirePro M6000 vs Radeon R7 M275DX

In this comparison between FirePro M6000 and Radeon R7 M275DX you will find out which graphics card performs better in today's games. Bear in mind that third-party versions may have more efficient cooling and higher clock speeds. This will increase cards' performance, though not by much. In addition to raw power you should also take into account the dimensions. Thicker models simply will not fit into a small mini-ITX case. The resolution of your monitor also affects the choice, since 4K gameplay requires a more powerful GPU. And don't overspend on the graphics card. Other parts of your build may also need to be upgraded, save some money for the CPU or power supply. For some people FirePro M6000 will be the best choice, for others Radeon R7 M275DX will be their preference. Study the comparison tables below and make your choice.

FirePro M6000 and Radeon R7 M275DX are Laptop Graphics Cards

Note: FirePro M6000 and Radeon R7 M275DX are only used in laptop graphics. They have lower GPU clock speed compared to the desktop variant, which results in lower power consumption, but also 10-30% lower gaming performance. Check available laptop models with FirePro M6000 or Radeon R7 M275DX here:

Main Specs

  FirePro M6000 Radeon R7 M275DX
Power consumption (TDP) 43 Watt
Interface MXM-B (3.0)
Supplementary power connectors None
Memory type GDDR5 DDR3
Maximum RAM amount 2 GB
Display Connectors No outputs
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  • FirePro M6000 is used in Mobile workstations, and Radeon R7 M275DX - in Laptops.
  • FirePro M6000 and Radeon R7 M275DX are build with GCN architecture.
  • FirePro M6000 and Radeon R7 M275DX are manufactured by 28 nm process technology.

Game benchmarks

high / 1080p 8−9 9−10
ultra / 1080p 5−6 5−6
QHD / 1440p 0−1 0−1
low / 720p 20−22 21−24
medium / 1080p 10−12 10−12
The average gaming FPS of Radeon R7 M275DX in Assassin's Creed Odyssey is 9% more, than FirePro M6000.

Full Specs

  FirePro M6000 Radeon R7 M275DX
Architecture GCN GCN
Code name Heathrow
Type Mobile workstation Laptop
Release date 1 July 2012 4 June 2014
Pipelines 640 896
Core clock speed 750 MHz
Transistor count 1,500 million
Manufacturing process technology 28 nm 28 nm
Texture fill rate 32.00
Floating-point performance 1,024 gflops
Memory bus width 128 Bit
Memory clock speed 4500 MHz
Memory bandwidth 72 GB/s
Shared memory - +
DirectX 12 (11_1) DirectX 12, Shader 5.0
Shader Model 5.1
OpenGL 4.6
OpenCL 1.2
Vulkan 1.2.131
Bus support n/a
Laptop size medium sized medium sized
Eyefinity +
Form factor MXM-B
StereoOutput3D +
AppAcceleration +
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