FirePro S7150 vs Radeon R7 250

Find out if it is worth upgrading your current GPU setup by comparing FirePro S7150 and Radeon R7 250. Here you can take a closer look at graphics cards specs, such as core clock speed, memory type and size, display connectors, etc. The price, overall benchmark and gaming performances are usually defining factors when it comes to choosing between FirePro S7150 and Radeon R7 250. Make sure that the graphics card has compatible dimensions and will properly fit in your new or current computer case. Also these graphics cards may have different system power recommendations, so take that into consideration and upgrade your PSU if necessary.

Main Specs

  FirePro S7150 Radeon R7 250
Power consumption (TDP) 150 Watt 75 Watt
Interface PCIe 3.0 x16 PCIe 3.0 x8
Supplementary power connectors 1x 6-pin N/A
Memory type GDDR5 DDR3, GDDR5
Maximum RAM amount 8 GB 2 GB
Display Connectors No outputs 1x DVI, 1x HDMI, 1x VGA
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  • FirePro S7150 has 100% more power consumption, than Radeon R7 250.
  • FirePro S7150 is connected by PCIe 3.0 x16, and Radeon R7 250 uses PCIe 3.0 x8 interface.
  • FirePro S7150 has 6 GB more memory, than Radeon R7 250.
  • Both cards are used in Desktops.
  • FirePro S7150 is build with GCN 3.0 architecture, and Radeon R7 250 - with GCN.
  • FirePro S7150 and Radeon R7 250 are manufactured by 28 nm process technology.
  • FirePro S7150 is 73 mm longer, than Radeon R7 250.
  • Memory clock speed of FirePro S7150 is 3850 MHz higher, than Radeon R7 250.

Game benchmarks

high / 1080p 35−40 3−4
ultra / 1080p 21−24 1−2
QHD / 1440p 16−18 0−1
4K / 2160p 10−11
low / 720p 60−65 14−16
medium / 1080p 40−45 5−6
The average gaming FPS of FirePro S7150 in Assassin's Creed Odyssey is 583% more, than Radeon R7 250.

Full Specs

  FirePro S7150 Radeon R7 250
Architecture GCN 3.0 GCN
Code name Tonga Oland XT
Type Workstation Desktop
Release date 1 February 2016 1 October 2013
Pipelines 2048 384
Core clock speed 920 MHz
Boost Clock 1050 MHz
Transistor count 5,000 million 950 million
Manufacturing process technology 28 nm 28 nm
Texture fill rate 117.8 25.20
Floating-point performance 3,763 gflops 716.8 gflops
Length 241 mm 168 mm
Memory bus width 256 Bit 128 Bit
Memory clock speed 5000 MHz 1150 MHz
Memory bandwidth 160.0 GB/s 72 GB/s
Shared memory -
DirectX 12 (12_0)
Shader Model 6.3 5.1
OpenGL 4.6 4.6
OpenCL 2.0 1.2
Vulkan 1.2.131
FreeSync +
Bus support PCIe 3.0
HDMI +
Bitcoin / BTC (SHA256) 117 Mh/s
Design reference
CrossFire +
DDMA audio +
Ethereum / ETH (DaggerHashimoto) 3 Mh/s
AppAcceleration +
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