FirePro S7150 vs Radeon R7 A360

If you are going to buy a new graphics card and are choosing between FirePro S7150 and Radeon R7 A360, there are a couple of things to consider. Cards with more VRAM in general perform better and allow you to play on higher graphics settings. Size also makes a difference. A model with a large heatsink can occupy up to three expansion slots on a motherboard. Be sure you have enough room in your PC case. When comparing GPUs with different architectures, more processing cores and even higher TFLOPS will not always translate to better performance. To help you decide which GPU you need, we have measured frame rates in a number of popular games. For more on how the FirePro S7150 stacks up against Radeon R7 A360, check out specs charts below.
FirePro S7150
Radeon R7 A360

Main Specs

  FirePro S7150 Radeon R7 A360
Power consumption (TDP) 150 Watt
Interface PCIe 3.0 x16 PCIe 3.0 x8
Supplementary power connectors 1x 6-pin
Memory type GDDR5 GDDR5
Maximum RAM amount 8 GB 1 GB
Display Connectors No outputs No outputs
 
  • FirePro S7150 is connected by PCIe 3.0 x16, and Radeon R7 A360 uses PCIe 3.0 x8 interface.
  • FirePro S7150 has 7 GB more memory, than Radeon R7 A360.
  • Both cards are used in Desktops.
  • FirePro S7150 and Radeon R7 A360 are build with GCN 3.0 architecture.
  • Core clock speed of FirePro S7150 is 195 MHz higher, than Radeon R7 A360.
  • FirePro S7150 and Radeon R7 A360 are manufactured by 28 nm process technology.
  • Memory clock speed of FirePro S7150 is 4997 MHz higher, than Radeon R7 A360.

Game benchmarks

high / 1080p 35−40 0−1
ultra / 1080p 21−24
QHD / 1440p 16−18 0−1
4K / 2160p 10−11
low / 720p 60−65 1−2
medium / 1080p 40−45 0−1
The average gaming FPS of FirePro S7150 in Assassin's Creed Odyssey is 6100% more, than Radeon R7 A360.

Full Specs

  FirePro S7150 Radeon R7 A360
Architecture GCN 3.0 GCN 3.0
Code name Tonga Meso
Type Workstation Desktop
Release date 1 February 2016 5 May 2015
Pipelines 2048 384
Core clock speed 920 MHz 725 MHz
Boost Clock 980 MHz
Transistor count 5,000 million 1,550 million
Manufacturing process technology 28 nm 28 nm
Texture fill rate 117.8 23.52
Floating-point performance 3,763 gflops 864.0 gflops
Length 241 mm
Memory bus width 256 Bit 128 Bit
Memory clock speed 5000 MHz 3.6 GB/s
Memory bandwidth 160.0 GB/s 57.6 GB/s
DirectX 12 (12_0) 12 (12_0)
Shader Model 6.3 6.0
OpenGL 4.6 4.6
OpenCL 2.0 2.0
Vulkan 1.2.131 1.2