FirePro S9050 vs HD Graphics 630

If you are going to buy a new graphics card and are choosing between FirePro S9050 and HD Graphics 630, there are a couple of things to consider. Cards with more VRAM in general perform better and allow you to play on higher graphics settings. Size also makes a difference. A model with a large heatsink can occupy up to three expansion slots on a motherboard. Be sure you have enough room in your PC case. When comparing GPUs with different architectures, more processing cores and even higher TFLOPS will not always translate to better performance. To help you decide which GPU you need, we have measured frame rates in a number of popular games. For more on how the FirePro S9050 stacks up against HD Graphics 630, check out specs charts below.

Main Specs

  FirePro S9050 HD Graphics 630
Power consumption (TDP) 225 Watt 15 Watt
Interface PCIe 3.0 x16 PCIe 3.0 x1
Supplementary power connectors 1x 8-pin
Memory type GDDR5 DDR3L/LPDDR3/LPDDR4
Maximum RAM amount 12 GB 64 GB
Display Connectors 1x DisplayPort No outputs
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  • FirePro S9050 has 1400% more power consumption, than HD Graphics 630.
  • FirePro S9050 is connected by PCIe 3.0 x16, and HD Graphics 630 uses PCIe 3.0 x1 interface.
  • HD Graphics 630 has 52 GB more memory, than FirePro S9050.
  • Both cards are used in Desktops.
  • FirePro S9050 is build with GCN 1.0 architecture, and HD Graphics 630 - with Gen. 9.5 Kaby Lake.
  • Core clock speed of FirePro S9050 is 600 MHz higher, than HD Graphics 630.
  • FirePro S9050 is manufactured by 28 nm process technology, and HD Graphics 630 - by 14 nm process technology.

Game benchmarks

high / 1080p 20−22 3−4
ultra / 1080p 12−14 1−2
QHD / 1440p 6−7 0−1
4K / 2160p 5−6
low / 720p 35−40 14−16
medium / 1080p 24−27 5−6
The average gaming FPS of FirePro S9050 in Assassin's Creed Odyssey is 300% more, than HD Graphics 630.

Full Specs

  FirePro S9050 HD Graphics 630
Architecture GCN 1.0 Gen. 9.5 Kaby Lake
Code name Tahiti Kaby-Lake-H-GT2
Type Workstation Desktop
Release date 7 August 2014 1 January 2017
Pipelines 1792 24
Core clock speed 900 MHz 300 MHz
Boost Clock 1150 MHz
Transistor count 4,313 million 189 million
Manufacturing process technology 28 nm 14 nm
Texture fill rate 100.8 26.40
Floating-point performance 3,226 gflops 441.6 gflops
Length 254 mm
Memory bus width 384 Bit 64/128 Bit
Memory clock speed 5500 MHz
Memory bandwidth 264 GB/s
Shared memory +
DirectX 12 (11_1) 12 (12_1)
Shader Model 5.1 6.4
OpenGL 4.6 4.6
OpenCL 1.2 2.1
Vulkan 1.2.131 1.1.103
Bus support PCIe 3.0
Quick Sync +
Form factor full height / full length
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