FirePro V4900 vs Radeon R8 M535DX

In this comparison between FirePro V4900 and Radeon R8 M535DX you will find out which graphics card performs better in today's games. Bear in mind that third-party versions may have more efficient cooling and higher clock speeds. This will increase cards' performance, though not by much. In addition to raw power you should also take into account the dimensions. Thicker models simply will not fit into a small mini-ITX case. The resolution of your monitor also affects the choice, since 4K gameplay requires a more powerful GPU. And don't overspend on the graphics card. Other parts of your build may also need to be upgraded, save some money for the CPU or power supply. For some people FirePro V4900 will be the best choice, for others Radeon R8 M535DX will be their preference. Study the comparison tables below and make your choice.

Main Specs

  FirePro V4900 Radeon R8 M535DX
Power consumption (TDP) 75 Watt
Interface PCIe 2.0 x16 IGP
Supplementary power connectors None
Memory type GDDR5 System Shared
Maximum RAM amount 1 GB
Display Connectors 1x DVI, 2x DisplayPort No outputs
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  • FirePro V4900 is connected by PCIe 2.0 x16, and Radeon R8 M535DX uses IGP interface.
  • Both cards are used in Desktops.
  • FirePro V4900 is build with TeraScale 2 architecture, and Radeon R8 M535DX - with GCN 3.0.
  • Core clock speed of FirePro V4900 is 20 MHz higher, than Radeon R8 M535DX.
  • FirePro V4900 is manufactured by 40 nm process technology, and Radeon R8 M535DX - by 28 nm process technology.

Game benchmarks

high / 1080p 2−3 0−1
ultra / 1080p 1−2
QHD / 1440p 0−1 0−1
low / 720p 12−14 1−2
medium / 1080p 4−5 0−1
The average gaming FPS of FirePro V4900 in Assassin's Creed Odyssey is 1200% more, than Radeon R8 M535DX.

Full Specs

  FirePro V4900 Radeon R8 M535DX
Architecture TeraScale 2 GCN 3.0
Code name Turks Meso
Type Workstation Desktop
Release date 1 November 2011 18 April 2017
Pipelines 480 320
Core clock speed 800 MHz 780 MHz
Boost Clock 891 MHz
Transistor count 716 million 1,550 million
Manufacturing process technology 40 nm 28 nm
Texture fill rate 19.20 17.82
Floating-point performance 768.0 gflops
Length 163 mm
Memory bus width 128 Bit
Memory clock speed 4000 MHz
Memory bandwidth 64 GB/s
DirectX 11.2 (11_0) 12 (12_0)
Shader Model 5.0 6.0
OpenGL 4.4 4.6
OpenCL 1.2 2.0
Vulkan N/A 1.2.131
Bitcoin / BTC (SHA256) 73 Mh/s
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