FirePro V4900 vs Radeon R9 270X

When choosing between FirePro V4900 and Radeon R9 270X, it is worth examining the specifications of the models in detail. Do they meet the recommended requirements of modern games and software? Storage capacity, form factor, TDP, available ports, warranty and manufacturer support are all important. For example, the size of a PC case can limit the maximum thickness and length of the card. Often, instead of the factory overclocked card and RGB backlight, it is better to choose a reference model with a more efficient GPU. And make sure that your current power supply unit has the correct connection pins (using adapters is not recommended). This GPUs compare tool is meant to help you to choose the best graphics card for your build. Let's find out the difference between FirePro V4900 and Radeon R9 270X.

Main Specs

  FirePro V4900 Radeon R9 270X
Power consumption (TDP) 75 Watt 180 Watt
Interface PCIe 2.0 x16 PCIe 3.0 x16
Supplementary power connectors None 2 x 6-pin
Memory type GDDR5 GDDR5
Maximum RAM amount 1 GB 2 GB
Display Connectors 1x DVI, 2x DisplayPort 2x DVI, 1x HDMI, 1x DisplayPort
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  • Radeon R9 270X has 140% more power consumption, than FirePro V4900.
  • FirePro V4900 is connected by PCIe 2.0 x16, and Radeon R9 270X uses PCIe 3.0 x16 interface.
  • Radeon R9 270X has 1 GB more memory, than FirePro V4900.
  • Both cards are used in Desktops.
  • FirePro V4900 is build with TeraScale 2 architecture, and Radeon R9 270X - with GCN.
  • FirePro V4900 is manufactured by 40 nm process technology, and Radeon R9 270X - by 28 nm process technology.

Game benchmarks

high / 1080p 2−3 24−27
ultra / 1080p 1−2 14−16
QHD / 1440p 0−1 10−11
4K / 2160p 6−7
low / 720p 12−14 45−50
medium / 1080p 4−5 30−35
The average gaming FPS of Radeon R9 270X in Assassin's Creed Odyssey is 500% more, than FirePro V4900.

Full Specs

  FirePro V4900 Radeon R9 270X
Architecture TeraScale 2 GCN
Code name Turks Curacao XT
Type Workstation Desktop
Release date 1 November 2011 8 October 2013
Pipelines 480 1280
Core clock speed 800 MHz
Boost Clock 1050 MHz
Transistor count 716 million 2,800 million
Manufacturing process technology 40 nm 28 nm
Texture fill rate 19.20 84.00
Floating-point performance 768.0 gflops 2,688 gflops
Length 163 mm
Memory bus width 128 Bit 256 Bit
Memory clock speed 4000 MHz
Memory bandwidth 64 GB/s 179.2 GB/s
Shared memory -
DirectX 11.2 (11_0)
Shader Model 5.0 5.1
OpenGL 4.4 4.6
OpenCL 1.2 1.2
Vulkan N/A +
FreeSync +
Bus support PCIe 3.0
HDMI +
Bitcoin / BTC (SHA256) 73 Mh/s 318 Mh/s
Eyefinity +
HD3D +
TrueAudio +
Design reference
DisplayPort support +
CrossFire +
DDMA audio +
Ethereum / ETH (DaggerHashimoto) 30 Mh/s
Zcash / ZEC (Equihash) 163 Sol/s
AppAcceleration +
LiquidVR +
TressFX +
UVD +
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