FirePro W8100 vs Radeon R7 M275DX

In this comparison between FirePro W8100 and Radeon R7 M275DX you will find out which graphics card performs better in today's games. Bear in mind that third-party versions may have more efficient cooling and higher clock speeds. This will increase cards' performance, though not by much. In addition to raw power you should also take into account the dimensions. Thicker models simply will not fit into a small mini-ITX case. The resolution of your monitor also affects the choice, since 4K gameplay requires a more powerful GPU. And don't overspend on the graphics card. Other parts of your build may also need to be upgraded, save some money for the CPU or power supply. For some people FirePro W8100 will be the best choice, for others Radeon R7 M275DX will be their preference. Study the comparison tables below and make your choice.

Radeon R7 M275DX is a Laptop Graphics Card

Note: Radeon R7 M275DX is only used in laptop graphics. It has lower GPU clock speed compared to the desktop variant, which results in lower power consumption, but also 10-30% lower gaming performance. Check available laptop models with Radeon R7 M275DX here:

Main Specs

  FirePro W8100 Radeon R7 M275DX
Power consumption (TDP) 220 Watt
Interface PCIe 3.0 x16
Supplementary power connectors 2x 6-pin
Memory type GDDR5 DDR3
Maximum RAM amount 8 GB
Display Connectors 4x DisplayPort, 1x SDI
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  • FirePro W8100 is used in Desktops, and Radeon R7 M275DX - in Laptops.
  • FirePro W8100 is build with GCN 2.0 architecture, and Radeon R7 M275DX - with GCN.
  • FirePro W8100 and Radeon R7 M275DX are manufactured by 28 nm process technology.

Game benchmarks

high / 1080p 35−40 9−10
ultra / 1080p 21−24 5−6
QHD / 1440p 16−18 0−1
4K / 2160p 10−11
low / 720p 60−65 21−24
medium / 1080p 40−45 10−12
The average gaming FPS of FirePro W8100 in Assassin's Creed Odyssey is 241% more, than Radeon R7 M275DX.

Full Specs

  FirePro W8100 Radeon R7 M275DX
Architecture GCN 2.0 GCN
Code name Hawaii
Type Workstation Laptop
Release date 23 June 2014 4 June 2014
Pipelines 2560 896
Core clock speed 824 MHz
Transistor count 6,200 million
Manufacturing process technology 28 nm 28 nm
Texture fill rate 131.8
Floating-point performance 4,219 gflops
Length 279 mm
Memory bus width 512 Bit
Memory clock speed 5000 MHz
Memory bandwidth 320 GB/s
Shared memory +
DirectX 12 (12_0) DirectX 12, Shader 5.0
Shader Model 6.3
OpenGL 4.6
OpenCL 2.0
Vulkan 1.2.131
Bus support PCIe 3.0
Bitcoin / BTC (SHA256) 466 Mh/s
Laptop size medium sized
Eyefinity +
Form factor full height / full length
StereoOutput3D +
DisplayPort count 4
Dual-link DVI support +
AppAcceleration +
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