FirePro W8100 vs Radeon R9 270

In this comparison between FirePro W8100 and Radeon R9 270 you will find out which graphics card performs better in today's games. Bear in mind that third-party versions may have more efficient cooling and higher clock speeds. This will increase cards' performance, though not by much. In addition to raw power you should also take into account the dimensions. Thicker models simply will not fit into a small mini-ITX case. The resolution of your monitor also affects the choice, since 4K gameplay requires a more powerful GPU. And don't overspend on the graphics card. Other parts of your build may also need to be upgraded, save some money for the CPU or power supply. For some people FirePro W8100 will be the best choice, for others Radeon R9 270 will be their preference. Study the comparison tables below and make your choice.

Main Specs

  FirePro W8100 Radeon R9 270
Power consumption (TDP) 220 Watt 150 Watt
Interface PCIe 3.0 x16 PCIe 3.0 x16
Supplementary power connectors 2x 6-pin 1 x 6-pin
Memory type GDDR5 GDDR5
Maximum RAM amount 8 GB 2 GB
Display Connectors 4x DisplayPort, 1x SDI 2x DVI, 1x HDMI, 1x DisplayPort
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  • FirePro W8100 has 46% more power consumption, than Radeon R9 270.
  • Both video cards are using PCIe 3.0 x16 interface connection to a motherboard.
  • FirePro W8100 has 6 GB more memory, than Radeon R9 270.
  • Both cards are used in Desktops.
  • FirePro W8100 is build with GCN 2.0 architecture, and Radeon R9 270 - with GCN 1.0.
  • FirePro W8100 and Radeon R9 270 are manufactured by 28 nm process technology.
  • FirePro W8100 is 69 mm longer, than Radeon R9 270.

Game benchmarks

high / 1080p 35−40 21−24
ultra / 1080p 21−24 12−14
QHD / 1440p 16−18 7−8
4K / 2160p 10−11 5−6
low / 720p 60−65 40−45
medium / 1080p 40−45 27−30
The average gaming FPS of FirePro W8100 in Assassin's Creed Odyssey is 68% more, than Radeon R9 270.

Full Specs

  FirePro W8100 Radeon R9 270
Architecture GCN 2.0 GCN 1.0
Code name Hawaii Curacao
Type Workstation Desktop
Release date 23 June 2014 13 November 2013
Pipelines 2560 1280
Core clock speed 824 MHz
Boost Clock 925 MHz
Transistor count 6,200 million 2,800 million
Manufacturing process technology 28 nm 28 nm
Texture fill rate 131.8 74.00
Floating-point performance 4,219 gflops 2,368 gflops
Length 279 mm 210 mm
Memory bus width 512 Bit 256 Bit
Memory clock speed 5000 MHz
Memory bandwidth 320 GB/s 179.2 GB/s
DirectX 12 (12_0)
Shader Model 6.3 5.1
OpenGL 4.6 4.6
OpenCL 2.0 1.2
Vulkan 1.2.131 +
FreeSync +
Bus support PCIe 3.0 PCIe 3.0
HDMI +
Bitcoin / BTC (SHA256) 466 Mh/s 293 Mh/s
Eyefinity +
HD3D +
TrueAudio +
Design reference
DisplayPort support +
CrossFire +
DDMA audio +
Ethereum / ETH (DaggerHashimoto) 16 Mh/s
Form factor full height / full length
StereoOutput3D +
DisplayPort count 4
Dual-link DVI support +
LiquidVR +
TressFX +
UVD +
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