FirePro W9000 vs Radeon R7 250

If you are going to buy a new graphics card and are choosing between FirePro W9000 and Radeon R7 250, there are a couple of things to consider. Cards with more VRAM in general perform better and allow you to play on higher graphics settings. Size also makes a difference. A model with a large heatsink can occupy up to three expansion slots on a motherboard. Be sure you have enough room in your PC case. When comparing GPUs with different architectures, more processing cores and even higher TFLOPS will not always translate to better performance. To help you decide which GPU you need, we have measured frame rates in a number of popular games. For more on how the FirePro W9000 stacks up against Radeon R7 250, check out specs charts below.

Main Specs

  FirePro W9000 Radeon R7 250
Power consumption (TDP) 350 Watt 75 Watt
Interface PCIe 3.0 x16 PCIe 3.0 x8
Supplementary power connectors 1x 6-pin + 1x 8-pin N/A
Memory type GDDR5 DDR3, GDDR5
Maximum RAM amount 6 GB 2 GB
Display Connectors 6x mini-DisplayPort, 1x SDI 1x DVI, 1x HDMI, 1x VGA
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  • FirePro W9000 has 366% more power consumption, than Radeon R7 250.
  • FirePro W9000 is connected by PCIe 3.0 x16, and Radeon R7 250 uses PCIe 3.0 x8 interface.
  • FirePro W9000 has 4 GB more memory, than Radeon R7 250.
  • Both cards are used in Desktops.
  • FirePro W9000 is build with GCN 1.0 architecture, and Radeon R7 250 - with GCN.
  • FirePro W9000 and Radeon R7 250 are manufactured by 28 nm process technology.
  • FirePro W9000 is 111 mm longer, than Radeon R7 250.
  • Memory clock speed of FirePro W9000 is 4350 MHz higher, than Radeon R7 250.

Game benchmarks

high / 1080p 35−40 3−4
ultra / 1080p 21−24 1−2
QHD / 1440p 16−18 0−1
4K / 2160p 10−11
low / 720p 60−65 14−16
medium / 1080p 40−45 5−6
The average gaming FPS of FirePro W9000 in Assassin's Creed Odyssey is 583% more, than Radeon R7 250.

Full Specs

  FirePro W9000 Radeon R7 250
Architecture GCN 1.0 GCN
Code name Tahiti Oland XT
Type Workstation Desktop
Release date 14 June 2012 1 October 2013
Pipelines 2048 384
Core clock speed 975 MHz
Boost Clock 1050 MHz
Transistor count 4,313 million 950 million
Manufacturing process technology 28 nm 28 nm
Texture fill rate 124.8 25.20
Floating-point performance 3,994 gflops 716.8 gflops
Length 279 mm 168 mm
Memory bus width 384 Bit 128 Bit
Memory clock speed 5500 MHz 1150 MHz
Memory bandwidth 264 GB/s 72 GB/s
Shared memory -
DirectX 12 (11_1)
Shader Model 5.1 5.1
OpenGL 4.6 4.6
OpenCL 1.2 1.2
Vulkan 1.2.131
FreeSync +
Bus support PCIe 3.0 PCIe 3.0
HDMI +
Bitcoin / BTC (SHA256) 460 Mh/s 117 Mh/s
Design reference
CrossFire +
DDMA audio +
Ethereum / ETH (DaggerHashimoto) 3 Mh/s
Form factor full height / full length
StereoOutput3D +
Dual-link DVI support +
AppAcceleration +
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