GeForce GTX 560 Ti vs Radeon R9 270X

When choosing between GeForce GTX 560 Ti and Radeon R9 270X, it is worth examining the specifications of the models in detail. Do they meet the recommended requirements of modern games and software? Storage capacity, form factor, TDP, available ports, warranty and manufacturer support are all important. For example, the size of a PC case can limit the maximum thickness and length of the card. Often, instead of the factory overclocked card and RGB backlight, it is better to choose a reference model with a more efficient GPU. And make sure that your current power supply unit has the correct connection pins (using adapters is not recommended). This GPUs compare tool is meant to help you to choose the best graphics card for your build. Let's find out the difference between GeForce GTX 560 Ti and Radeon R9 270X.

Main Specs

  GeForce GTX 560 Ti Radeon R9 270X
Power consumption (TDP) 170 Watt 180 Watt
Interface PCIe 2.0 x16 PCIe 3.0 x16
Supplementary power connectors 2x 6-pin 2 x 6-pin
Memory type GDDR5 GDDR5
Maximum RAM amount 1 GB 2 GB
Display Connectors 2x DVI, 1x mini-HDMI 2x DVI, 1x HDMI, 1x DisplayPort
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  • Radeon R9 270X has 5% more power consumption, than GeForce GTX 560 Ti.
  • GeForce GTX 560 Ti is connected by PCIe 2.0 x16, and Radeon R9 270X uses PCIe 3.0 x16 interface.
  • Radeon R9 270X has 1 GB more memory, than GeForce GTX 560 Ti.
  • Both cards are used in Desktops.
  • GeForce GTX 560 Ti is build with Fermi architecture, and Radeon R9 270X - with GCN.
  • GeForce GTX 560 Ti is manufactured by 40 nm process technology, and Radeon R9 270X - by 28 nm process technology.

Game benchmarks

high / 1080p 16−18 24−27
ultra / 1080p 9−10 14−16
QHD / 1440p 4−5 10−11
4K / 2160p 6−7
low / 720p 30−35 45−50
medium / 1080p 18−20 30−35
The average gaming FPS of Radeon R9 270X in Assassin's Creed Odyssey is 62% more, than GeForce GTX 560 Ti.

Full Specs

  GeForce GTX 560 Ti Radeon R9 270X
Architecture Fermi GCN
Code name GF114 Curacao XT
Type Desktop Desktop
Release date 25 January 2011 8 October 2013
Pipelines 384 1280
Core clock speed 822 MHz
Boost Clock 1050 MHz
Transistor count 1,950 million 2,800 million
Manufacturing process technology 40 nm 28 nm
Texture fill rate 52.67 84.00
Floating-point performance 1,263.4 gflops 2,688 gflops
Length 229 mm
Memory bus width 256 Bit 256 Bit
Memory clock speed 2004 MHz
Memory bandwidth 128.3 GB/s 179.2 GB/s
Shared memory -
DirectX 12 (11_0)
Shader Model 5.1 5.1
OpenGL 4.6 4.6
OpenCL 1.1 1.2
Vulkan N/A +
CUDA 2.1
FreeSync +
Bus support PCIe 3.0
HDMI +
Bitcoin / BTC (SHA256) 87 Mh/s 318 Mh/s
Eyefinity +
HD3D +
TrueAudio +
Design reference
DisplayPort support +
CrossFire +
DDMA audio +
Decred / DCR (Decred) 0.39 Gh/s
Ethereum / ETH (DaggerHashimoto) 30 Mh/s
Zcash / ZEC (Equihash) 163 Sol/s
AppAcceleration +
LiquidVR +
TressFX +
UVD +
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