FirePro R5000 vs GRID K260Q

If you are going to buy a new graphics card and are choosing between FirePro R5000 and GRID K260Q, there are a couple of things to consider. Cards with more VRAM in general perform better and allow you to play on higher graphics settings. Size also makes a difference. A model with a large heatsink can occupy up to three expansion slots on a motherboard. Be sure you have enough room in your PC case. When comparing GPUs with different architectures, more processing cores and even higher TFLOPS will not always translate to better performance. To help you decide which GPU you need, we have measured frame rates in a number of popular games. For more on how the FirePro R5000 stacks up against GRID K260Q, check out specs charts below.

Main Specs

  FirePro R5000 GRID K260Q
Power consumption (TDP) 350 Watt 225 Watt
Interface PCIe 3.0 x16 PCIe 3.0 x16
Supplementary power connectors 1x 6-pin
Memory type GDDR5 GDDR5
Maximum RAM amount 2 GB 2 GB
Display Connectors 2x mini-DisplayPort No outputs
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  • FirePro R5000 has 55% more power consumption, than GRID K260Q.
  • Both video cards are using PCIe 3.0 x16 interface connection to a motherboard.
  • FirePro R5000 and GRID K260Q have maximum RAM of 2 GB.
  • Both cards are used in Desktops.
  • FirePro R5000 is build with GCN 1.0 architecture, and GRID K260Q - with Kepler.
  • Core clock speed of FirePro R5000 is 80 MHz higher, than GRID K260Q.
  • FirePro R5000 and GRID K260Q are manufactured by 28 nm process technology.
  • Memory clock speed of GRID K260Q is 1800 MHz higher, than FirePro R5000.

Game benchmarks

high / 1080p 12−14 14−16
ultra / 1080p 8−9 9−10
QHD / 1440p 2−3 3−4
low / 720p 27−30 30−35
medium / 1080p 16−18 18−20
The average gaming FPS of GRID K260Q in Assassin's Creed Odyssey is 15% more, than FirePro R5000.

Full Specs

  FirePro R5000 GRID K260Q
Architecture GCN 1.0 Kepler
Code name Pitcairn GK104
Type Workstation Workstation
Release date 25 February 2013 28 June 2013
Pipelines 768 1536
Core clock speed 825 MHz 745 MHz
Transistor count 2,800 million 3,540 million
Manufacturing process technology 28 nm 28 nm
Texture fill rate 39.60 95.36
Floating-point performance 1,267 gflops 2,289 gflops
Length 279 mm
Memory bus width 256 Bit 256 Bit
Memory clock speed 3200 MHz 5000 MHz
Memory bandwidth 102.4 GB/s 160.0 GB/s
DirectX 12 (11_1) 12 (11_0)
Shader Model 5.1 5.1
OpenGL 4.6 4.6
OpenCL 1.2 1.2
Vulkan 1.2.131 1.1.126
CUDA 3.0
Bus support PCIe 3.0
Form factor full height / full length
Dual-link DVI support +
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