FirePro W4100 vs GRID K260Q

If you are going to buy a new graphics card and are choosing between FirePro W4100 and GRID K260Q, there are a couple of things to consider. Cards with more VRAM in general perform better and allow you to play on higher graphics settings. Size also makes a difference. A model with a large heatsink can occupy up to three expansion slots on a motherboard. Be sure you have enough room in your PC case. When comparing GPUs with different architectures, more processing cores and even higher TFLOPS will not always translate to better performance. To help you decide which GPU you need, we have measured frame rates in a number of popular games. For more on how the FirePro W4100 stacks up against GRID K260Q, check out specs charts below.

Main Specs

  FirePro W4100 GRID K260Q
Power consumption (TDP) 50 Watt 225 Watt
Interface PCIe 3.0 x16 PCIe 3.0 x16
Supplementary power connectors None
Memory type GDDR5 GDDR5
Maximum RAM amount 2 GB 2 GB
Display Connectors 4x mini-DisplayPort No outputs
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  • GRID K260Q has 350% more power consumption, than FirePro W4100.
  • Both video cards are using PCIe 3.0 x16 interface connection to a motherboard.
  • FirePro W4100 and GRID K260Q have maximum RAM of 2 GB.
  • Both cards are used in Desktops.
  • FirePro W4100 is build with GCN architecture, and GRID K260Q - with Kepler.
  • Core clock speed of GRID K260Q is 115 MHz higher, than FirePro W4100.
  • FirePro W4100 and GRID K260Q are manufactured by 28 nm process technology.
  • Memory clock speed of GRID K260Q is 1000 MHz higher, than FirePro W4100.

Game benchmarks

high / 1080p 6−7 14−16
ultra / 1080p 4−5 9−10
QHD / 1440p 0−1 3−4
low / 720p 16−18 30−35
medium / 1080p 8−9 18−20
The average gaming FPS of GRID K260Q in Assassin's Creed Odyssey is 111% more, than FirePro W4100.

Full Specs

  FirePro W4100 GRID K260Q
Architecture GCN Kepler
Code name Cape Verde GK104
Type Workstation Workstation
Release date 2 October 2015 28 June 2013
Pipelines 512 1536
Core clock speed 630 MHz 745 MHz
Transistor count 1,500 million 3,540 million
Manufacturing process technology 28 nm 28 nm
Texture fill rate 20.16 95.36
Floating-point performance 645.1 gflops 2,289 gflops
Length 171 mm
Memory bus width 128 Bit 256 Bit
Memory clock speed 4000 MHz 5000 MHz
Memory bandwidth 72 GB/s 160.0 GB/s
Shared memory -
DirectX 12 (11_1) 12 (11_0)
Shader Model 5.1 5.1
OpenGL 4.6 4.6
OpenCL 1.2 1.2
Vulkan 1.2.131 1.1.126
CUDA 3.0
Bus support PCIe 3.0
Bitcoin / BTC (SHA256) 79 Mh/s
Form factor low profile / half length
Dual-link DVI support +
AppAcceleration +
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