Iris Xe Graphics G7 vs Radeon R7 260X

If you are going to buy a new graphics card and are choosing between Iris Xe Graphics G7 and Radeon R7 260X, there are a couple of things to consider. Cards with more VRAM in general perform better and allow you to play on higher graphics settings. Size also makes a difference. A model with a large heatsink can occupy up to three expansion slots on a motherboard. Be sure you have enough room in your PC case. When comparing GPUs with different architectures, more processing cores and even higher TFLOPS will not always translate to better performance. To help you decide which GPU you need, we have measured frame rates in a number of popular games. For more on how the Iris Xe Graphics G7 stacks up against Radeon R7 260X, check out specs charts below.

Iris Xe Graphics G7 is a Laptop Graphics Card

Note: Iris Xe Graphics G7 is only used in laptop graphics. It has lower GPU clock speed compared to the desktop variant, which results in lower power consumption, but also 10-30% lower gaming performance. Check available laptop models with Iris Xe Graphics G7 here:

Main Specs

  Iris Xe Graphics G7 Radeon R7 260X
Power consumption (TDP) 115 Watt
Interface PCIe 3.0 x16
Supplementary power connectors 1 x 6-pin
Memory type DDR4 GDDR5
Maximum RAM amount 4 GB
Display Connectors 2x DVI, 1x HDMI, 1x DisplayPort
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  • Iris Xe Graphics G7 is used in Laptops, and Radeon R7 260X - in Desktops.
  • Iris Xe Graphics G7 is build with Gen. 11 Ice Lake architecture, and Radeon R7 260X - with GCN 2.0.
  • Iris Xe Graphics G7 is manufactured by 10 nm process technology, and Radeon R7 260X - by 28 nm process technology.

Game benchmarks

high / 1080p 16−18 16−18
ultra / 1080p 9−10 9−10
QHD / 1440p 3−4 4−5
low / 720p 30−35 30−35
medium / 1080p 20−22 20−22
Iris Xe Graphics G7 and Radeon R7 260X have the same average FPS in Assassin's Creed Odyssey.

Full Specs

  Iris Xe Graphics G7 Radeon R7 260X
Architecture Gen. 11 Ice Lake GCN 2.0
Code name Tiger Lake Xe Bonaire
Type Laptop Desktop
Release date 15 August 2020 8 October 2013
Pipelines 96 896
Boost Clock 1000 MHz
Transistor count 2,080 million
Manufacturing process technology 10 nm 28 nm
Texture fill rate 61.60
Floating-point performance 1,971 gflops
Length 170 mm
Memory bus width 128 Bit
Memory bandwidth 104 GB/s
Shared memory +
DirectX DirectX 12_1
Shader Model 6.3
OpenGL 4.6
OpenCL 2.0
FreeSync +
Bus support PCIe 3.0
HDMI +
Bitcoin / BTC (SHA256) 225 Mh/s
Eyefinity +
Design reference
DDMA audio +
Ethereum / ETH (DaggerHashimoto) 5.16 Mh/s
Quick Sync +
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