FirePro W4100 vs NVS 510

When choosing between FirePro W4100 and NVS 510, it is worth examining the specifications of the models in detail. Do they meet the recommended requirements of modern games and software? Storage capacity, form factor, TDP, available ports, warranty and manufacturer support are all important. For example, the size of a PC case can limit the maximum thickness and length of the card. Often, instead of the factory overclocked card and RGB backlight, it is better to choose a reference model with a more efficient GPU. And make sure that your current power supply unit has the correct connection pins (using adapters is not recommended). This GPUs compare tool is meant to help you to choose the best graphics card for your build. Let's find out the difference between FirePro W4100 and NVS 510.

Main Specs

  FirePro W4100 NVS 510
Power consumption (TDP) 50 Watt 35 Watt
Interface PCIe 3.0 x16 PCIe 2.0 x16
Supplementary power connectors None None
Memory type GDDR5 DDR3
Maximum RAM amount 2 GB 2 GB
Display Connectors 4x mini-DisplayPort 4x mini-DisplayPort
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  • FirePro W4100 has 42% more power consumption, than NVS 510.
  • FirePro W4100 is connected by PCIe 3.0 x16, and NVS 510 uses PCIe 2.0 x16 interface.
  • FirePro W4100 and NVS 510 have maximum RAM of 2 GB.
  • Both cards are used in Desktops.
  • FirePro W4100 is build with GCN architecture, and NVS 510 - with Kepler.
  • Core clock speed of NVS 510 is 167 MHz higher, than FirePro W4100.
  • FirePro W4100 and NVS 510 are manufactured by 28 nm process technology.
  • FirePro W4100 is 11 mm longer, than NVS 510.
  • Memory clock speed of FirePro W4100 is 2218 MHz higher, than NVS 510.

Game benchmarks

high / 1080p 6−7 0−1
ultra / 1080p 4−5
QHD / 1440p 0−1 0−1
low / 720p 16−18 1−2
medium / 1080p 8−9 0−1
The average gaming FPS of FirePro W4100 in Assassin's Creed Odyssey is 1600% more, than NVS 510.

Full Specs

  FirePro W4100 NVS 510
Architecture GCN Kepler
Code name Cape Verde GK107
Type Workstation Workstation
Release date 2 October 2015 23 October 2012
Pipelines 512 192
Core clock speed 630 MHz 797 MHz
Transistor count 1,500 million 1,270 million
Manufacturing process technology 28 nm 28 nm
Texture fill rate 20.16 12.75
Floating-point performance 645.1 gflops 306.0 gflops
Length 171 mm 160 mm
Memory bus width 128 Bit 128 Bit
Memory clock speed 4000 MHz 1782 MHz
Memory bandwidth 72 GB/s 28.51 GB/s
Shared memory -
DirectX 12 (11_1) 12 (11_0)
Shader Model 5.1 5.1
OpenGL 4.6 4.6
OpenCL 1.2 1.2
Vulkan 1.2.131 1.1.126
CUDA 3.0
Bus support PCIe 3.0
Bitcoin / BTC (SHA256) 79 Mh/s 17 Mh/s
Form factor low profile / half length
Dual-link DVI support +
AppAcceleration +
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