FirePro W8100 vs Radeon HD 6740G2

When choosing between FirePro W8100 and Radeon HD 6740G2, it is worth examining the specifications of the models in detail. Do they meet the recommended requirements of modern games and software? Storage capacity, form factor, TDP, available ports, warranty and manufacturer support are all important. For example, the size of a PC case can limit the maximum thickness and length of the card. Often, instead of the factory overclocked card and RGB backlight, it is better to choose a reference model with a more efficient GPU. And make sure that your current power supply unit has the correct connection pins (using adapters is not recommended). This GPUs compare tool is meant to help you to choose the best graphics card for your build. Let's find out the difference between FirePro W8100 and Radeon HD 6740G2.

Radeon HD 6740G2 is a Laptop Graphics Card

Note: Radeon HD 6740G2 is only used in laptop graphics. It has lower GPU clock speed compared to the desktop variant, which results in lower power consumption, but also 10-30% lower gaming performance. Check available laptop models with Radeon HD 6740G2 here:

Main Specs

  FirePro W8100 Radeon HD 6740G2
Power consumption (TDP) 220 Watt
Interface PCIe 3.0 x16
Supplementary power connectors 2x 6-pin
Memory type GDDR5
Maximum RAM amount 8 GB
Display Connectors 4x DisplayPort, 1x SDI
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  • FirePro W8100 is used in Desktops, and Radeon HD 6740G2 - in Laptops.
  • FirePro W8100 is build with GCN 2.0 architecture, and Radeon HD 6740G2 - with Terascale 2.
  • FirePro W8100 is manufactured by 28 nm process technology, and Radeon HD 6740G2 - by 40 nm process technology.

Game benchmarks

high / 1080p 35−40 0−1
ultra / 1080p 21−24 0−1
QHD / 1440p 16−18 0−1
4K / 2160p 10−11
low / 720p 60−65 10−12
medium / 1080p 40−45 2−3
The average gaming FPS of FirePro W8100 in Assassin's Creed Odyssey is 766% more, than Radeon HD 6740G2.

Full Specs

  FirePro W8100 Radeon HD 6740G2
Architecture GCN 2.0 Terascale 2
Code name Hawaii
Type Workstation Laptop
Release date 23 June 2014 14 June 2011
Pipelines 2560 880
Core clock speed 824 MHz
Transistor count 6,200 million
Manufacturing process technology 28 nm 40 nm
Texture fill rate 131.8
Floating-point performance 4,219 gflops
Length 279 mm
Memory bus width 512 Bit
Memory clock speed 5000 MHz
Memory bandwidth 320 GB/s
Shared memory -
DirectX 12 (12_0) DirectX 11, Shader 5.0
Shader Model 6.3
OpenGL 4.6
OpenCL 2.0
Vulkan 1.2.131
Bus support PCIe 3.0
Bitcoin / BTC (SHA256) 466 Mh/s
Laptop size medium sized
Form factor full height / full length
StereoOutput3D +
DisplayPort count 4
Dual-link DVI support +
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