FirePro W7100 vs Radeon R6 Carrizo

If you are going to buy a new graphics card and are choosing between FirePro W7100 and Radeon R6 Carrizo, there are a couple of things to consider. Cards with more VRAM in general perform better and allow you to play on higher graphics settings. Size also makes a difference. A model with a large heatsink can occupy up to three expansion slots on a motherboard. Be sure you have enough room in your PC case. When comparing GPUs with different architectures, more processing cores and even higher TFLOPS will not always translate to better performance. To help you decide which GPU you need, we have measured frame rates in a number of popular games. For more on how the FirePro W7100 stacks up against Radeon R6 Carrizo, check out specs charts below.

Radeon R6 Carrizo is a Laptop Graphics Card

Note: Radeon R6 Carrizo is only used in laptop graphics. It has lower GPU clock speed compared to the desktop variant, which results in lower power consumption, but also 10-30% lower gaming performance. Check available laptop models with Radeon R6 Carrizo here:

Main Specs

  FirePro W7100 Radeon R6 Carrizo
Power consumption (TDP) 400 Watt 12-35 Watt
Interface PCIe 3.0 x16
Supplementary power connectors 1x 6-pin
Memory type GDDR5
Maximum RAM amount 8 GB
Display Connectors 4x DisplayPort
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  • FirePro W7100 has 3233% more power consumption, than Radeon R6 Carrizo.
  • FirePro W7100 is used in Desktops, and Radeon R6 Carrizo - in Laptops.
  • FirePro W7100 is build with GCN 3.0 architecture, and Radeon R6 Carrizo - with GCN 1.2/2.0.
  • FirePro W7100 and Radeon R6 Carrizo are manufactured by 28 nm process technology.

Game benchmarks

high / 1080p 35−40 0−1
ultra / 1080p 21−24 0−1
QHD / 1440p 16−18 0−1
4K / 2160p 10−11
low / 720p 60−65 10−12
medium / 1080p 40−45 2−3
The average gaming FPS of FirePro W7100 in Assassin's Creed Odyssey is 766% more, than Radeon R6 Carrizo.

Full Specs

  FirePro W7100 Radeon R6 Carrizo
Architecture GCN 3.0 GCN 1.2/2.0
Code name Tonga Carrizo
Type Workstation Laptop
Release date 12 August 2014 4 June 2015
Pipelines 1792 384
Core clock speed 920 MHz
Boost Clock 800 MHz
Transistor count 5,000 million 2410 Million
Manufacturing process technology 28 nm 28 nm
Texture fill rate 103.0
Floating-point performance 3,297 gflops
Length 241 mm
Memory bus width 256 Bit 64/128 Bit
Memory clock speed 5000 MHz
Memory bandwidth 160 GB/s
Shared memory +
DirectX 12 (12_0) DirectX 12 (FL 12_0)
Shader Model 6.3
OpenGL 4.6
OpenCL 2.0
Vulkan 1.2.131
Bus support PCIe 3.0
Bitcoin / BTC (SHA256) 362 Mh/s
Laptop size medium sized
Form factor full height / full length
StereoOutput3D +
DisplayPort count 4
Dual-link DVI support +
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