FirePro S9050 vs Radeon R7 260X

If you are going to buy a new graphics card and are choosing between FirePro S9050 and Radeon R7 260X, there are a couple of things to consider. Cards with more VRAM in general perform better and allow you to play on higher graphics settings. Size also makes a difference. A model with a large heatsink can occupy up to three expansion slots on a motherboard. Be sure you have enough room in your PC case. When comparing GPUs with different architectures, more processing cores and even higher TFLOPS will not always translate to better performance. To help you decide which GPU you need, we have measured frame rates in a number of popular games. For more on how the FirePro S9050 stacks up against Radeon R7 260X, check out specs charts below.

Main Specs

  FirePro S9050 Radeon R7 260X
Power consumption (TDP) 225 Watt 115 Watt
Interface PCIe 3.0 x16 PCIe 3.0 x16
Supplementary power connectors 1x 8-pin 1 x 6-pin
Memory type GDDR5 GDDR5
Maximum RAM amount 12 GB 4 GB
Display Connectors 1x DisplayPort 2x DVI, 1x HDMI, 1x DisplayPort
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  • FirePro S9050 has 95% more power consumption, than Radeon R7 260X.
  • Both video cards are using PCIe 3.0 x16 interface connection to a motherboard.
  • FirePro S9050 has 8 GB more memory, than Radeon R7 260X.
  • Both cards are used in Desktops.
  • FirePro S9050 is build with GCN 1.0 architecture, and Radeon R7 260X - with GCN 2.0.
  • FirePro S9050 and Radeon R7 260X are manufactured by 28 nm process technology.
  • FirePro S9050 is 84 mm longer, than Radeon R7 260X.

Game benchmarks

high / 1080p 20−22 16−18
ultra / 1080p 12−14 9−10
QHD / 1440p 6−7 4−5
4K / 2160p 5−6
low / 720p 35−40 30−35
medium / 1080p 24−27 20−22
The average gaming FPS of FirePro S9050 in Assassin's Creed Odyssey is 25% more, than Radeon R7 260X.

Full Specs

  FirePro S9050 Radeon R7 260X
Architecture GCN 1.0 GCN 2.0
Code name Tahiti Bonaire
Type Workstation Desktop
Release date 7 August 2014 8 October 2013
Pipelines 1792 896
Core clock speed 900 MHz
Boost Clock 1000 MHz
Transistor count 4,313 million 2,080 million
Manufacturing process technology 28 nm 28 nm
Texture fill rate 100.8 61.60
Floating-point performance 3,226 gflops 1,971 gflops
Length 254 mm 170 mm
Memory bus width 384 Bit 128 Bit
Memory clock speed 5500 MHz
Memory bandwidth 264 GB/s 104 GB/s
DirectX 12 (11_1)
Shader Model 5.1 6.3
OpenGL 4.6 4.6
OpenCL 1.2 2.0
Vulkan 1.2.131
FreeSync +
Bus support PCIe 3.0 PCIe 3.0
HDMI +
Bitcoin / BTC (SHA256) 225 Mh/s
Eyefinity +
Design reference
DDMA audio +
Ethereum / ETH (DaggerHashimoto) 5.16 Mh/s
Form factor full height / full length
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