GeForce GTX 560 SE vs Radeon R7 260X

If you are going to buy a new graphics card and are choosing between GeForce GTX 560 SE and Radeon R7 260X, there are a couple of things to consider. Cards with more VRAM in general perform better and allow you to play on higher graphics settings. Size also makes a difference. A model with a large heatsink can occupy up to three expansion slots on a motherboard. Be sure you have enough room in your PC case. When comparing GPUs with different architectures, more processing cores and even higher TFLOPS will not always translate to better performance. To help you decide which GPU you need, we have measured frame rates in a number of popular games. For more on how the GeForce GTX 560 SE stacks up against Radeon R7 260X, check out specs charts below.

Main Specs

  GeForce GTX 560 SE Radeon R7 260X
Power consumption (TDP) 150 Watt 115 Watt
Interface PCIe 2.0 x16 PCIe 3.0 x16
Supplementary power connectors 2x 6-pin 1 x 6-pin
Memory type GDDR5 GDDR5
Maximum RAM amount 1 GB 4 GB
Display Connectors 2x DVI, 1x mini-HDMI 2x DVI, 1x HDMI, 1x DisplayPort
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  • GeForce GTX 560 SE has 30% more power consumption, than Radeon R7 260X.
  • GeForce GTX 560 SE is connected by PCIe 2.0 x16, and Radeon R7 260X uses PCIe 3.0 x16 interface.
  • Radeon R7 260X has 3 GB more memory, than GeForce GTX 560 SE.
  • Both cards are used in Desktops.
  • GeForce GTX 560 SE is build with Fermi 2.0 architecture, and Radeon R7 260X - with GCN 2.0.
  • GeForce GTX 560 SE is manufactured by 40 nm process technology, and Radeon R7 260X - by 28 nm process technology.
  • GeForce GTX 560 SE is 40 mm longer, than Radeon R7 260X.

Game benchmarks

high / 1080p 9−10 16−18
ultra / 1080p 5−6 9−10
QHD / 1440p 0−1 4−5
low / 720p 21−24 30−35
medium / 1080p 10−12 20−22
The average gaming FPS of Radeon R7 260X in Assassin's Creed Odyssey is 66% more, than GeForce GTX 560 SE.

Full Specs

  GeForce GTX 560 SE Radeon R7 260X
Architecture Fermi 2.0 GCN 2.0
Code name GF114 Bonaire
Type Desktop Desktop
Release date 20 February 2012 8 October 2013
Pipelines 288 896
Core clock speed 736 MHz
Boost Clock 1000 MHz
Transistor count 1,950 million 2,080 million
Manufacturing process technology 40 nm 28 nm
Texture fill rate 35.33 61.60
Floating-point performance 847.9 gflops 1,971 gflops
Length 210 mm 170 mm
Memory bus width 192 Bit 128 Bit
Memory clock speed 3828 MHz
Memory bandwidth 91.87 GB/s 104 GB/s
DirectX 12 (11_0)
Shader Model 5.1 6.3
OpenGL 4.6 4.6
OpenCL 1.1 2.0
Vulkan N/A
CUDA 2.1
FreeSync +
Bus support PCIe 3.0
HDMI +
Bitcoin / BTC (SHA256) 54 Mh/s 225 Mh/s
Eyefinity +
Design reference
DDMA audio +
Ethereum / ETH (DaggerHashimoto) 5.16 Mh/s
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