FirePro S9050 vs Radeon R7 A360

If you are going to buy a new graphics card and are choosing between FirePro S9050 and Radeon R7 A360, there are a couple of things to consider. Cards with more VRAM in general perform better and allow you to play on higher graphics settings. Size also makes a difference. A model with a large heatsink can occupy up to three expansion slots on a motherboard. Be sure you have enough room in your PC case. When comparing GPUs with different architectures, more processing cores and even higher TFLOPS will not always translate to better performance. To help you decide which GPU you need, we have measured frame rates in a number of popular games. For more on how the FirePro S9050 stacks up against Radeon R7 A360, check out specs charts below.

Main Specs

  FirePro S9050 Radeon R7 A360
Power consumption (TDP) 225 Watt
Interface PCIe 3.0 x16 PCIe 3.0 x8
Supplementary power connectors 1x 8-pin
Memory type GDDR5 GDDR5
Maximum RAM amount 12 GB 1 GB
Display Connectors 1x DisplayPort No outputs
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  • FirePro S9050 is connected by PCIe 3.0 x16, and Radeon R7 A360 uses PCIe 3.0 x8 interface.
  • FirePro S9050 has 11 GB more memory, than Radeon R7 A360.
  • Both cards are used in Desktops.
  • FirePro S9050 is build with GCN 1.0 architecture, and Radeon R7 A360 - with GCN 3.0.
  • Core clock speed of FirePro S9050 is 175 MHz higher, than Radeon R7 A360.
  • FirePro S9050 and Radeon R7 A360 are manufactured by 28 nm process technology.
  • Memory clock speed of FirePro S9050 is 5497 MHz higher, than Radeon R7 A360.

Game benchmarks

high / 1080p 20−22 0−1
ultra / 1080p 12−14
QHD / 1440p 6−7 0−1
4K / 2160p 5−6
low / 720p 35−40 1−2
medium / 1080p 24−27 0−1
The average gaming FPS of FirePro S9050 in Assassin's Creed Odyssey is 3600% more, than Radeon R7 A360.

Full Specs

  FirePro S9050 Radeon R7 A360
Architecture GCN 1.0 GCN 3.0
Code name Tahiti Meso
Type Workstation Desktop
Release date 7 August 2014 5 May 2015
Pipelines 1792 384
Core clock speed 900 MHz 725 MHz
Boost Clock 980 MHz
Transistor count 4,313 million 1,550 million
Manufacturing process technology 28 nm 28 nm
Texture fill rate 100.8 23.52
Floating-point performance 3,226 gflops 864.0 gflops
Length 254 mm
Memory bus width 384 Bit 128 Bit
Memory clock speed 5500 MHz 3.6 GB/s
Memory bandwidth 264 GB/s 57.6 GB/s
DirectX 12 (11_1) 12 (12_0)
Shader Model 5.1 6.0
OpenGL 4.6 4.6
OpenCL 1.2 2.0
Vulkan 1.2.131 1.2
Bus support PCIe 3.0
Form factor full height / full length
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