FirePro V5900 vs Radeon R7 A360

If you are going to buy a new graphics card and are choosing between FirePro V5900 and Radeon R7 A360, there are a couple of things to consider. Cards with more VRAM in general perform better and allow you to play on higher graphics settings. Size also makes a difference. A model with a large heatsink can occupy up to three expansion slots on a motherboard. Be sure you have enough room in your PC case. When comparing GPUs with different architectures, more processing cores and even higher TFLOPS will not always translate to better performance. To help you decide which GPU you need, we have measured frame rates in a number of popular games. For more on how the FirePro V5900 stacks up against Radeon R7 A360, check out specs charts below.

Main Specs

  FirePro V5900 Radeon R7 A360
Power consumption (TDP) 75 Watt
Interface PCIe 2.0 x16 PCIe 3.0 x8
Supplementary power connectors None
Memory type GDDR5 GDDR5
Maximum RAM amount 2 GB 1 GB
Display Connectors 1x DVI No outputs
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  • FirePro V5900 is connected by PCIe 2.0 x16, and Radeon R7 A360 uses PCIe 3.0 x8 interface.
  • FirePro V5900 has 1 GB more memory, than Radeon R7 A360.
  • Both cards are used in Desktops.
  • FirePro V5900 is build with TeraScale 3 architecture, and Radeon R7 A360 - with GCN 3.0.
  • Core clock speed of Radeon R7 A360 is 125 MHz higher, than FirePro V5900.
  • FirePro V5900 is manufactured by 40 nm process technology, and Radeon R7 A360 - by 28 nm process technology.
  • Memory clock speed of FirePro V5900 is 1997 MHz higher, than Radeon R7 A360.

Game benchmarks

high / 1080p 4−5 0−1
ultra / 1080p 2−3
QHD / 1440p 1−2 0−1
low / 720p 14−16 1−2
medium / 1080p 7−8 0−1
The average gaming FPS of FirePro V5900 in Assassin's Creed Odyssey is 1400% more, than Radeon R7 A360.

Full Specs

  FirePro V5900 Radeon R7 A360
Architecture TeraScale 3 GCN 3.0
Code name Cayman Meso
Type Workstation Desktop
Release date 24 May 2011 5 May 2015
Pipelines 512 384
Core clock speed 600 MHz 725 MHz
Boost Clock 980 MHz
Transistor count 2,640 million 1,550 million
Manufacturing process technology 40 nm 28 nm
Texture fill rate 19.20 23.52
Floating-point performance 614.4 gflops 864.0 gflops
Length 230 mm
Memory bus width 256 Bit 128 Bit
Memory clock speed 2000 MHz 3.6 GB/s
Memory bandwidth 64 GB/s 57.6 GB/s
DirectX 11.2 (11_0) 12 (12_0)
Shader Model 5.0 6.0
OpenGL 4.4 4.6
OpenCL 1.2 2.0
Vulkan N/A 1.2
Bitcoin / BTC (SHA256) 66 Mh/s
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