FirePro W4100 vs Radeon R7 A360

If you are going to buy a new graphics card and are choosing between FirePro W4100 and Radeon R7 A360, there are a couple of things to consider. Cards with more VRAM in general perform better and allow you to play on higher graphics settings. Size also makes a difference. A model with a large heatsink can occupy up to three expansion slots on a motherboard. Be sure you have enough room in your PC case. When comparing GPUs with different architectures, more processing cores and even higher TFLOPS will not always translate to better performance. To help you decide which GPU you need, we have measured frame rates in a number of popular games. For more on how the FirePro W4100 stacks up against Radeon R7 A360, check out specs charts below.

Main Specs

  FirePro W4100 Radeon R7 A360
Power consumption (TDP) 50 Watt
Interface PCIe 3.0 x16 PCIe 3.0 x8
Supplementary power connectors None
Memory type GDDR5 GDDR5
Maximum RAM amount 2 GB 1 GB
Display Connectors 4x mini-DisplayPort No outputs
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  • FirePro W4100 is connected by PCIe 3.0 x16, and Radeon R7 A360 uses PCIe 3.0 x8 interface.
  • FirePro W4100 has 1 GB more memory, than Radeon R7 A360.
  • Both cards are used in Desktops.
  • FirePro W4100 is build with GCN architecture, and Radeon R7 A360 - with GCN 3.0.
  • Core clock speed of Radeon R7 A360 is 95 MHz higher, than FirePro W4100.
  • FirePro W4100 and Radeon R7 A360 are manufactured by 28 nm process technology.
  • Memory clock speed of FirePro W4100 is 3997 MHz higher, than Radeon R7 A360.

Game benchmarks

high / 1080p 6−7 0−1
ultra / 1080p 4−5
QHD / 1440p 0−1 0−1
low / 720p 16−18 1−2
medium / 1080p 8−9 0−1
The average gaming FPS of FirePro W4100 in Assassin's Creed Odyssey is 1600% more, than Radeon R7 A360.

Full Specs

  FirePro W4100 Radeon R7 A360
Architecture GCN GCN 3.0
Code name Cape Verde Meso
Type Workstation Desktop
Release date 2 October 2015 5 May 2015
Pipelines 512 384
Core clock speed 630 MHz 725 MHz
Boost Clock 980 MHz
Transistor count 1,500 million 1,550 million
Manufacturing process technology 28 nm 28 nm
Texture fill rate 20.16 23.52
Floating-point performance 645.1 gflops 864.0 gflops
Length 171 mm
Memory bus width 128 Bit 128 Bit
Memory clock speed 4000 MHz 3.6 GB/s
Memory bandwidth 72 GB/s 57.6 GB/s
Shared memory -
DirectX 12 (11_1) 12 (12_0)
Shader Model 5.1 6.0
OpenGL 4.6 4.6
OpenCL 1.2 2.0
Vulkan 1.2.131 1.2
Bus support PCIe 3.0
Bitcoin / BTC (SHA256) 79 Mh/s
Form factor low profile / half length
Dual-link DVI support +
AppAcceleration +
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