FirePro W9000 vs Radeon R7 M275DX

If you are going to buy a new graphics card and are choosing between FirePro W9000 and Radeon R7 M275DX, there are a couple of things to consider. Cards with more VRAM in general perform better and allow you to play on higher graphics settings. Size also makes a difference. A model with a large heatsink can occupy up to three expansion slots on a motherboard. Be sure you have enough room in your PC case. When comparing GPUs with different architectures, more processing cores and even higher TFLOPS will not always translate to better performance. To help you decide which GPU you need, we have measured frame rates in a number of popular games. For more on how the FirePro W9000 stacks up against Radeon R7 M275DX, check out specs charts below.

Radeon R7 M275DX is a Laptop Graphics Card

Note: Radeon R7 M275DX is only used in laptop graphics. It has lower GPU clock speed compared to the desktop variant, which results in lower power consumption, but also 10-30% lower gaming performance. Check available laptop models with Radeon R7 M275DX here:

Main Specs

  FirePro W9000 Radeon R7 M275DX
Power consumption (TDP) 350 Watt
Interface PCIe 3.0 x16
Supplementary power connectors 1x 6-pin + 1x 8-pin
Memory type GDDR5 DDR3
Maximum RAM amount 6 GB
Display Connectors 6x mini-DisplayPort, 1x SDI
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  • FirePro W9000 is used in Desktops, and Radeon R7 M275DX - in Laptops.
  • FirePro W9000 is build with GCN 1.0 architecture, and Radeon R7 M275DX - with GCN.
  • FirePro W9000 and Radeon R7 M275DX are manufactured by 28 nm process technology.

Game benchmarks

high / 1080p 35−40 9−10
ultra / 1080p 21−24 5−6
QHD / 1440p 16−18 0−1
4K / 2160p 10−11
low / 720p 60−65 21−24
medium / 1080p 40−45 10−12
The average gaming FPS of FirePro W9000 in Assassin's Creed Odyssey is 241% more, than Radeon R7 M275DX.

Full Specs

  FirePro W9000 Radeon R7 M275DX
Architecture GCN 1.0 GCN
Code name Tahiti
Type Workstation Laptop
Release date 14 June 2012 4 June 2014
Pipelines 2048 896
Core clock speed 975 MHz
Transistor count 4,313 million
Manufacturing process technology 28 nm 28 nm
Texture fill rate 124.8
Floating-point performance 3,994 gflops
Length 279 mm
Memory bus width 384 Bit
Memory clock speed 5500 MHz
Memory bandwidth 264 GB/s
Shared memory +
DirectX 12 (11_1) DirectX 12, Shader 5.0
Shader Model 5.1
OpenGL 4.6
OpenCL 1.2
Vulkan 1.2.131
Bus support PCIe 3.0
Bitcoin / BTC (SHA256) 460 Mh/s
Laptop size medium sized
Eyefinity +
Form factor full height / full length
StereoOutput3D +
Dual-link DVI support +
AppAcceleration +
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