FirePro W8100 vs Radeon R9 270X

If you are going to buy a new graphics card and are choosing between FirePro W8100 and Radeon R9 270X, there are a couple of things to consider. Cards with more VRAM in general perform better and allow you to play on higher graphics settings. Size also makes a difference. A model with a large heatsink can occupy up to three expansion slots on a motherboard. Be sure you have enough room in your PC case. When comparing GPUs with different architectures, more processing cores and even higher TFLOPS will not always translate to better performance. To help you decide which GPU you need, we have measured frame rates in a number of popular games. For more on how the FirePro W8100 stacks up against Radeon R9 270X, check out specs charts below.

Main Specs

  FirePro W8100 Radeon R9 270X
Power consumption (TDP) 220 Watt 180 Watt
Interface PCIe 3.0 x16 PCIe 3.0 x16
Supplementary power connectors 2x 6-pin 2 x 6-pin
Memory type GDDR5 GDDR5
Maximum RAM amount 8 GB 2 GB
Display Connectors 4x DisplayPort, 1x SDI 2x DVI, 1x HDMI, 1x DisplayPort
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  • FirePro W8100 has 22% more power consumption, than Radeon R9 270X.
  • Both video cards are using PCIe 3.0 x16 interface connection to a motherboard.
  • FirePro W8100 has 6 GB more memory, than Radeon R9 270X.
  • Both cards are used in Desktops.
  • FirePro W8100 is build with GCN 2.0 architecture, and Radeon R9 270X - with GCN.
  • FirePro W8100 and Radeon R9 270X are manufactured by 28 nm process technology.

Game benchmarks

high / 1080p 35−40 24−27
ultra / 1080p 21−24 14−16
QHD / 1440p 16−18 10−11
4K / 2160p 10−11 6−7
low / 720p 60−65 45−50
medium / 1080p 40−45 30−35
The average gaming FPS of FirePro W8100 in Assassin's Creed Odyssey is 45% more, than Radeon R9 270X.

Full Specs

  FirePro W8100 Radeon R9 270X
Architecture GCN 2.0 GCN
Code name Hawaii Curacao XT
Type Workstation Desktop
Release date 23 June 2014 8 October 2013
Pipelines 2560 1280
Core clock speed 824 MHz
Boost Clock 1050 MHz
Transistor count 6,200 million 2,800 million
Manufacturing process technology 28 nm 28 nm
Texture fill rate 131.8 84.00
Floating-point performance 4,219 gflops 2,688 gflops
Length 279 mm
Memory bus width 512 Bit 256 Bit
Memory clock speed 5000 MHz
Memory bandwidth 320 GB/s 179.2 GB/s
Shared memory -
DirectX 12 (12_0)
Shader Model 6.3 5.1
OpenGL 4.6 4.6
OpenCL 2.0 1.2
Vulkan 1.2.131 +
FreeSync +
Bus support PCIe 3.0 PCIe 3.0
HDMI +
Bitcoin / BTC (SHA256) 466 Mh/s 318 Mh/s
Eyefinity +
HD3D +
TrueAudio +
Design reference
DisplayPort support +
CrossFire +
DDMA audio +
Ethereum / ETH (DaggerHashimoto) 30 Mh/s
Zcash / ZEC (Equihash) 163 Sol/s
Form factor full height / full length
StereoOutput3D +
DisplayPort count 4
Dual-link DVI support +
AppAcceleration +
LiquidVR +
TressFX +
UVD +
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