Radeon R9 290X vs Tesla C2075

When choosing between Radeon R9 290X and Tesla C2075, it is worth examining the specifications of the models in detail. Do they meet the recommended requirements of modern games and software? Storage capacity, form factor, TDP, available ports, warranty and manufacturer support are all important. For example, the size of a PC case can limit the maximum thickness and length of the card. Often, instead of the factory overclocked card and RGB backlight, it is better to choose a reference model with a more efficient GPU. And make sure that your current power supply unit has the correct connection pins (using adapters is not recommended). This GPUs compare tool is meant to help you to choose the best graphics card for your build. Let's find out the difference between Radeon R9 290X and Tesla C2075.

Main Specs

  Radeon R9 290X Tesla C2075
Power consumption (TDP) 250 Watt 247 Watt
Interface PCIe 3.0 x16 PCIe 2.0 x16
Supplementary power connectors 1 x 6-pin + 1 x 8-pin 1x 6-pin + 1x 8-pin
Memory type GDDR5 GDDR5
Maximum RAM amount 4 GB 6 GB
Display Connectors 2x DVI, 1x HDMI, 1x DisplayPort 1x DVI
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  • Radeon R9 290X has 1% more power consumption, than Tesla C2075.
  • Radeon R9 290X is connected by PCIe 3.0 x16, and Tesla C2075 uses PCIe 2.0 x16 interface.
  • Tesla C2075 has 2 GB more memory, than Radeon R9 290X.
  • Both cards are used in Desktops.
  • Radeon R9 290X is build with GCN architecture, and Tesla C2075 - with Fermi 2.0.
  • Radeon R9 290X is manufactured by 28 nm process technology, and Tesla C2075 - by 40 nm process technology.
  • Radeon R9 290X is 27 mm longer, than Tesla C2075.
  • Memory clock speed of Tesla C2075 is 1882 MHz higher, than Radeon R9 290X.

Game benchmarks

high / 1080p 35−40 16−18
ultra / 1080p 24−27 10−11
QHD / 1440p 18−20 4−5
4K / 2160p 10−11
low / 720p 60−65 35−40
medium / 1080p 45−50 21−24
The average gaming FPS of Radeon R9 290X in Assassin's Creed Odyssey is 111% more, than Tesla C2075.

Full Specs

  Radeon R9 290X Tesla C2075
Architecture GCN Fermi 2.0
Code name Hawaii XT GF110
Type Desktop Workstation
Release date 24 October 2013 25 July 2011
Pipelines 2816 448
Core clock speed 574 MHz
Boost Clock 947 MHz
Transistor count 6,200 million 3,000 million
Manufacturing process technology 28 nm 40 nm
Texture fill rate 176.0 32.14
Floating-point performance 5,632 gflops 1,030.4 gflops
Length 275 mm 248 mm
Memory bus width 512 Bit 384 Bit
Memory clock speed 1250 MHz 3132 MHz
Memory bandwidth 320 GB/s 150.3 GB/s
Shared memory -
DirectX 12 (11_0)
Shader Model 6.3 5.1
OpenGL 4.6 4.6
OpenCL 2.0 1.1
Vulkan + N/A
CUDA 2.0
Monero / XMR (CryptoNight) 0.76 kh/s
FreeSync +
Bus support PCIe 3.0
HDMI +
Bitcoin / BTC (SHA256) 623 Mh/s 94 Mh/s
Eyefinity +
HD3D +
TrueAudio +
Design reference
DisplayPort support +
CrossFire +
DDMA audio +
Decred / DCR (Decred) 1.07 Gh/s
Ethereum / ETH (DaggerHashimoto) 25.75 Mh/s
Zcash / ZEC (Equihash) 350 Sol/s
AppAcceleration +
LiquidVR +
TressFX +
UVD +
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