Samsung HBM3 chips failed Nvidia tests due to heat and power issues

Samsung's high-bandwidth memory (HBM) chips intended for use in Nvidia's artificial intelligence accelerators have failed tests due to heat and power consumption issues. This has raised doubts about their performance. It is noted that these problems also affect Samsung's HBM3E chips, which were introduced a few months ago.

Here's What We Know

While Samsung's HBM3 chips continue to fail tests, it is reported that SK Hynix has started shipping Nvidia's HBM3E chips in March 2024. Samsung has stated that HBM chips require "optimisation to meet customer needs" and is actively working on further improvements.

HBM chips are critical to the operation of AI chips, and SK Hynix is the largest supplier of HBM chips to Nvidia. Nvidia has 80 per cent of the AI market, so it is important for Samsung to get Nvidia certification in order to have meaningful business in the HBM market.

Samsung also supplies HBM chips to AMD. Nvidia and AMD want Samsung to resolve the HBM issues to get a steady supply of HBM chips from at least two suppliers to keep the price low.

It is unclear whether the heat and power consumption issues found in Samsung's HBM3 and HBM3E chips can be immediately resolved. However, Samsung recently replaced the head of its Device Solutions business and brought back an old specialist who has played a key role in DRAM and NAND flash development in the past. The company hopes that these issues will be resolved and it will begin mass production of HBM3E chips by the end of the second quarter of this year.

Source: Reuters