Samsung develops new cooling technology for future Exynos processors

Samsung is reportedly developing a new cooling solution for future Exynos smartphone processors.

Here's What We Know

This packaging technology, inspired by PCs and servers, involves the use of a heat sink attached to the top of the processor. The development is expected to be completed by Q4 2024. This makes it a potential addition to the Exynos 2500, which is likely to be used in some Galaxy S25 models.

The Exynos 2400 performed slightly worse in the heat test than the Snapdragon 8 Gen 3. The 2022 Exynos 2200 had even more serious overheating issues.

The new FOWLP-HPB (Fan-out wafer-level package-HPB) packaging technology aims to solve these problems with a heatsink called the HPB (Heat Path Block). It is used in PCs and servers and has not been used in smartphones before due to their smaller form factor.

Samsung hopes that the FOWLP-HPB will improve cooling, stabilise performance, increase battery life, and generally lead to cooler phones.

If the development is completed on time, the Exynos 2500 could be the first smartphone chipset to receive this innovation. This would be a significant step forward for Samsung as it looks to compete with Qualcomm in the mobile processor space.

Source: Elec