Apple delays new iPhone design due to component issues
Apple has again postponed the introduction of a new iPhone design, which was supposed to reduce the size of the phone and free up more space for other components.
Here's What We Know
The design change, which included the use of new epoxy-coated copper components (RCC), was initially expected in the iPhone 16, then moved to the iPhone 17, and now has been postponed again.
更新： 因無法滿足Apple對品質的高標準要求，2025年新款iPhone 17將不採用RCC作為PCB主板材料。
- 郭明錤 (Ming-Chi Kuo) (@mingchikuo) 17 July 2024
--
Update: Due to the inability to meet Apple's high-quality requirements, the new iPhone 17 in 2025 will not use RCC as the PCB motherboard material. https://t.co/ZInZnDqQqZ
The reason for the delay was problems with the durability and fragility of the new components, which did not meet Apple's high quality standards.
Although RCC can reduce the thickness of the motherboard and make the production process easier, Apple is not willing to compromise on quality for these benefits.
It is not known when Apple will be able to solve the problems with RCC and introduce a new design. Perhaps the change will be delayed until the iPhone 18 or even further.
Source: 9to5Mac
