Samsung and Apple strengthen collaboration to boost AI performance in iPhones
Samsung and Apple continue to work closely together despite the competition. Samsung, an important supplier of components to Apple such as memory chips and OLED displays, is making changes to its DRAM packaging method at Apple's request. These changes will improve artificial intelligence on the iPhone.
Here's What We Know
Currently in the iPhone, LPDDR memory is stacked and packaged on top of the chipset. The new memory packaging separate from the system semiconductor will increase memory bandwidth, which will improve AI performance. New iPhones with this technology are expected to be available in 2026.
The current system limits the number of I/O pins, which constrains bus width and channel. Using discrete memory would bypass these limitations by improving thermal management and preventing trotting.
Apple already uses discrete memory in Macs and iPads, allowing for more I/O pins and better thermal management.
Source: thelec
