Insider: Honor is preparing to launch foldable smartphones Magic V2 Flip and Magic V4 in June
Honor is gearing up to launch several new smartphones in the Chinese market, including the Honor 400 series, Honor GT Pro, and new foldable devices such as the Magic V4 and Magic V2 Flip. Recently, an insider at Digital Chat Station shared details about the Magic V4 in a post on Weibo, and now he has also revealed the first details about the Magic V2 Flip.
Here's What We Know
According to Digital Chat Station, the Honor Magic V2 Flip will feature a customised LTPO panel and will be powered by a Snapdragon 8 Gen 3 chipset. However, other characteristics of the device have not yet been disclosed. For comparison, last year's Honor Magic V Flip had a 6.8-inch foldable LTPO OLED display and was powered by the Snapdragon 8+ Gen 1 chipset.
As for the Magic V4, according to the insider, this smartphone will have a customised LTPO folding display with a diagonal of about 8 inches. For security, a fingerprint sensor is built in on the side panel. The gadget will be powered by the Snapdragon 8 Elite chipset. In China, it will compete with the Oppo Find N5, which is likely to receive a 7-core version of the chip, unlike the Magic V4, which is likely to have a standard 8-core version of the chipset.
The Magic V4 will also feature a 50-megapixel primary sensor with a telephoto lens. Although it is expected to retain the periscopic telephoto lens, its quality will not be at the level of flagship models.
One of the main advantages of the new generation will be its reduced thickness. The Magic V4 is likely to be thinner than its predecessor, the Magic V3, which was 9.2 mm thick when folded.
Both foldable devices are expected to hit the market around June this year.
Source: Digital Chat Station, Gizmochina
