Insider: Honor Magic Fold smartphone will get Snapdragon 898 chip and will be released in the first half of 2022
We have already heard more than once that Honor, after separating from Huawei, plans to launch its first foldable smartphone on the market. Now another details about the new product have surfaced online.
What's known
According to insider Teme, the Magic Fold should not be expected anytime soon. If everything goes according to plan, the device will be introduced in the first half of 2022. The novelty will boast of a new flagship chip Qualcomm Snapdragon 898 (SM8450), which will be built on 4-nanometer process technology. Incidentally, according to the source, it is also attributed to the Mate X3 foldable smartphone, the Mate 50 lineup and the Magic 4 smartphones, which could be released in the second half of 2022.
Mate X3 (H1 2022)
- Teme (特米) (@RODENT950) August 15, 2021
Mate 50 series (H1 2022)
Magic Fold (H1 2022)
Magic 4 series (H2 2022)
Snapdragon SM8450 (4nm) pic.twitter.com/OU7pXHc2pd
Recall, Honor Magic Fold will get a form factor like Galaxy Z Fold 2 and Huawei Mate X2. The device will also be equipped with 12GB of RAM and two displays: the main one at 8 inches and an additional one on the outside with a diagonal of 6.5 inches. By the way, similar diagonal screens had the original Huawei Mate X.
Source: Twitter
