Qualcomm Snapdragon 898 and MediaTek Dimensity 2000 specifications became available

Both MediaTek and Qualcomm are developing new flagship SoCs that will form the basis of most top-of-the-line smartphones released in 2022. The announcement of the new chips is still to come, but their basic specifications have already leaked online via Chinese blogger Digital Chat Station, which published insider information.

According to these data, production of the flagship SoC Qualcomm Snapdragon 898 will be engaged South Korean company Samsung. The chip will be manufactured on 4-nanometer process. The new SoC will consist of 8 processor cores and integrated graphics accelerator Adreno 730. The processor cores are divided into multiple clusters - one fast Cortex-X2 clocked at 3 GHz, three 2.5 GHz Cortex-A710 cores with medium performance and 4 x lean Cortex-A510 cores clocked at 1.79 GHz.

As for MediaTek Dimensity 2000, this chip will have an identical configuration to Qualcomm's SoC, but the three middle cores will run at a higher clock speed of 2.85GHz versus 2.5GHz. The integrated graphics accelerator here is the Mali-G710 MC10. The new MediaTek SoCs will be manufactured using Taiwanese TSMC's 4nm process technology.

Exactly when the new Qualcomm and MediaTek processors should be released is not reported. Qualcomm Snapdragon 898 is expected to be announced during Qualcomm's traditional meeting with its partners, which is held in December each year.

Source: gsmarena