MediaTek's Dimensity 9400 SoC could contain more than 30 billion transistors

According to recent rumours, MediaTek is preparing to release its new flagship Dimensity 9400 SoC processor, which could contain more than 30 billion transistors. This number is impressive considering that Apple's A13 Bionic processor used in the iPhone 11 contains 8.5 billion transistors and the A17 Pro processor used in the iPhone 15 Pro and iPhone 15 Pro Max contains 19 billion transistors.

Here's What We Know

The Dimensity 9400 will feature one Cortex-X5 core, four Cortex-X4 cores, and four Cortex-A720 cores. This processor will not contain any power efficient cores.

Dimensity 9400 will also feature a larger Neural Network Processing Unit (NPU) for AI and machine learning, and a larger cache. This processor will be the largest smartphone chipset when it is unveiled this year, as it will be 150 mm² in size.

The Dimensity 9400's graphics performance is expected to increase by 20 per cent over the Dimensity 9300, which could surpass the Snapdragon 8 Gen 4.

The Dimensity 9400 will be manufactured on TSMC's second generation 3nm process (N3E), which will likely make it the most expensive smartphone chipset ever developed by MediaTek.

There has been talk recently that the powerful core of this processor, the Cortex-X5, has some issues with elevated temperatures. One theory is that MediaTek has increased the chip's crystal size to address this issue.

Source: Wccftech