Insider: Xiaomi is working on a CIVI 3 smartphone with a MediaTek Dimensity 8200 chip and a curved AMOLED screen

By: Myroslav Trinko | 20.01.2023, 06:52
Insider: Xiaomi is working on a CIVI 3 smartphone with a MediaTek Dimensity 8200 chip and a curved AMOLED screen

Xiaomi showed the CIVI 2 smartphone in China in September 2022, and now it is working on its successor.

Here's What We Know

According to a Chinese insider, the Xiaomi CIVI 3 is already in development. Unlike the current model, the novelty will be equipped with a MediaTek processor. Presumably, we are talking about eight-core SoC Dimensity 8200. In addition, the device will get AMOLED-display with curved edges and a resolution of FHD +, as well as a dual main camera. The sensor will be placed on an elongated opening.

Unfortunately, there are no other details about the Xiaomi CIVI 3 yet. As for the release date, the novelty should be presented at the end of 2023.

Source: Gizmochina