The chip is designed for budget smartphones. It is built on the 6-nanometre TSMC process and has 1 core Cortex A76 at 2.4 GHz and six cores Cortex A55 at 2.0 GHz. For graphics processing in the novelty is responsible GPU Mali G57 MC2. Dimensity 6300 got support for LPDDR4x RAM, as well as UFS 2.2 storage.
According to recent rumours, MediaTek is preparing to release its new flagship Dimensity 9400 SoC processor, which could contain more than 30 billion transistors. This number is impressive considering that Apple's A13 Bionic processor used in the iPhone 11 contains 8.5 billion transistors and the A17 Pro processor used in the iPhone 15 Pro and iPhone 15 Pro Max contains 19 billion transistors.
According to the latest rumours, Vivo has already signed a contract with MediaTek for its new Dimensity 9400 chipset, which is said to be 20% faster than its predecessor, the Dimensity 9300. It would launch in October 2023 and bring in around a billion dollars in revenue for the company. MediaTek hopes to continue this success with the Dimensity 9400, which is scheduled to launch in the second half of 2024.
The chip received the same specifications as the Helio G88 and Helio G85, but with an improved IPS module. That is, the novelty comes with two Crotex A75 cores (maximum frequency of 2.0 GHz) and six Cortex-A55 cores (maximum frequency of 1.8 GHz), as well as Mali-G52 MC2 graphics (maximum frequency of 1.0 GHz). The SoC is built on the same 12nm TSMC process.
MediaTek, two weeks after the release of its flagship Dimensity 9300 chip, has announced its simplified version.
Dimensity 8300 will be a simplified version of the flagship Dimensity 9300 chip. If rumours are to be believed, the SoC will get a 1+3+4 core layout: one Cortex X3 core clocked at 2.8GHz, three Cortex A714 cores at 2.4GHz and four Cortex A510 cores at 1.6GHz. It is also known that the Dimensity 8300 will come with 850MHz ARM Mali G52 MC6 graphics.
The SoC is based on TSMC's third-generation 4nm+ process technology. Its distinctive feature is its multi-core design: one Cotex-X4 core clocked at 3.25 GHz, three Cortex-X4 cores clocked at 2.85 GHz and four Cortex-A720 cores clocked at 2.0 GHz based on Armv9 architecture.
Not long ago we wrote that MediaTek will unveil its flagship Dimensity 9300 processor on 6 November. As it turned out, the company will show another mobile SoC at the event.
A few hours ago, it was reported on the internet that MediaTek will unveil the Dimensity 9300 chip on the 6th of November. Now the manufacturer has officially confirmed it.
We have written many times that MediaTek is preparing to release its flagship Dimensity 9300 processor. It seems that the release of the chip is not far off.
An unknown device with MediaTek's new flagship processor has been spotted in the AnTuTu performance test database.
We have already written many times that MediaTek is working on a new top-end Dimensity 9300 chip. Now the information about the SoC release date has appeared on the Internet.
We have already written many times that MediaTek is working on a new top-of-the-line Dimensity 9300 chipset. Now, thanks to an insider, the SoC specifications have appeared on the Internet.
The novelty is a slightly improved version of Dimensity 7200. The chip is built on TSMC's 4-nanometre 2nd generation process. It has two 2.8 GHz Cortex A715 cores, six 1.8 GHz Cortex A510 cores and Mali G610 MC4 graphics
The new chipset will be based on TSMC's 3-nanometre process. According to the manufacturer, it consumes the same amount of power as the 5nm N5 process, but boasts an 18% increase in speed.
