MediaTek, two weeks after the release of its flagship Dimensity 9300 chip, has announced its simplified version.
Here's What We Know
The chipset has been named MediaTek Dimensity 8300. It is the successor to last year's SoC Dimensity 8200. Dimensity 8300 is built on TSMC's second-generation 4-nanometre process. The new product has Mali G615 MC6 graphics and eight cores with 1 + 3 + 4 configuration: one Cortex A715 core at 3.35 GHz, three Cortex A715 cores at 3.2 GHz and four Cortex A510 cores at 2.2 GHz. According to the manufacturer, the new SoC boasts 20 per cent higher CPU performance and 30 per cent higher power efficiency compared to the previous generation chipset.
The Dimensity 8300 comes with support for cameras up to 320 MP, screens up to FHD+ 180 Hz or WQHD+ up to 120 Hz, WiFi 6E, Bluetooth 5.4, and LPDDR5X memory and UFS 4.0. The novelty features a 5G modem, Imagiq 980 ISP module for image processing and APU 780 module, which is responsible for the AI function.
When We Can Expect It
The first smartphones based on Dimensity 8300 will be released by the end of 2023.